Patent Number: 10,029,438

Title: Thermosetting resin composition and use thereof

Abstract: The present invention relates to a thermosetting resin composition, which comprises: (A) cyanate ester compound and/or cyanate ester prepolymer; and (B) polyphosphonate ester and/or phosphonate-carbonate copolymer. The thermosetting resin composition provided by the present invention has low dielectric constant and dielectric loss tangent. The prepreg and copper clad laminate made from the above-mentioned thermosetting resin composition have excellent dielectric properties and wet-heat resistance, UL94 V-0 flame resistance, and good processability.

Inventors: Zeng; Xianping (Guangdong, CN), Ren; Nana (Guangdong, CN)


International Classification: B32B 5/02 (20060101); C08J 5/24 (20060101); H05K 1/03 (20060101); C08L 79/04 (20060101); B32B 5/26 (20060101); C08L 85/02 (20060101); C08L 63/00 (20060101); C08K 5/00 (20060101); B32B 15/14 (20060101); C08G 73/06 (20060101)

Expiration Date: 2022-07-24 0:00:00