Patent Number: 6,165,386

Title: Photosetting conductive paste

Abstract: There is provided a photosetting conductive paste that has a surface resistance of no greater than 200 m.OMEGA./sq. upon curing by light irradiation. The photosetting conductive paste comprises conductive powder and a photosetting resin composition in specific amounts. The conductive powder contains dendritic conductive powder and scaly conductive powder at 80% or greater of the total conductive powder, the dendritic conductive powder having a mean particle size of 0.05-1.0 .mu.m, a specific surface area of 0.5-5.0 m.sup.2 /g, and the scaly conductive powder having a mean particle size of 1.0-10.0 .mu.m and a specific surface area of 0.5-5.0 m.sup.2 /g, wherein the weight ratio of the dendritic conductive powder and scaly conductive powder is 6/40-95/5. There is also provided a method of forming an antenna for a radio frequency identification medium that comprises printing the conductive paste on a substrate in an antenna-shaped pattern and curing it.

Inventors: Endo; Yasuhiro (Tokyo, JP), Kagami; Yasuo (Tokyo, JP), Maruyama; Toru (Saitama-ken, JP), Kodama; Kazunari (Tokyo, JP)

Assignee: Toppan Forms Co., Ltd.

International Classification: G06K 19/077 (20060101); H05K 1/09 (20060101); H05K 3/46 (20060101); H01B 001/22 ()

Expiration Date: 12/26/2017