Patent Number: 6,165,405

Title: Press for encapsulating electronic components and methods for use of the press

Abstract: A device for encapsulating electronic components mounted on lead frames in a mold assembled from two mold halves movable relative to each other and closable onto each other. The device for causing the mold halves to move and to close are formed by a rotatable eccentric which can be coupled to one of the mold halves with interposing of at least one connecting rod. The invention also relates to a method for driving such a connecting rod. Another aspect of the invention relates to an encapsulating device wherein a one mold half is connectable to the device for causing the mold halves to move and close and the second mold half is connectable to a counter-plate which forms part of the device, which counter-plate is displaceable between two end positions. Yet another aspect of the invention relates to an encapsulating device with a counter-plate that includes a plurality of stacked, substantially plate-like parts, between which parts at least one shaft is placed. A further aspect of the invention is formed by a device for exerting pressure on encapsulating material including at least two screw spindles.

Inventors: Harmsen; Wilhelmus Hendrikus Johannes (Wehl, NL), Van Haren; Lambertus Franciscus Wilhelmus (Druten, NL), Venrooij; Johannes Lambertus Gerardus Maria (Duiven, NL)

Assignee: Fico B.V.

International Classification: B29C 33/22 (20060101); B29C 45/02 (20060101); B29C 45/66 (20060101); B29C 045/02 (); B29C 045/66 ()

Expiration Date: 12/26/2017