Patent Number: 6,165,552

Title: Film forming method

Abstract: A film-forming method comprises the steps of: (a) holding a rectangular substrate by a spin chuck provided in a cup; (b) positioning a solvent supply nozzle above the rectangular substrate and supplying a solvent to the rectangular substrate, the solvent supply nozzle having a liquid discharge port which has a length at least corresponding to that of a peripheral portion of the rectangular substrate; (c) positioning a process liquid supply nozzle above the rectangular substrate and supplying a process liquid to a portion at a rotation center portion of the rectangular substrate, thereby to form a film; (d) rotating the rectangular substrate in the cup to adjust a film thickness of the film; and (e) thereafter positioning the solvent supply nozzle above one peripheral portion of the rectangular substrate and supplying the solvent to the one peripheral portion of the rectangular substrate, whereby the film is removed from the one peripheral portion of the rectangular substrate, the substrate being subsequently rotated by the spin chuck to position the solvent supply nozzle to another peripheral portion of the rectangular substrate, whereby the film is removed from the another peripheral portion of the rectangular substrate.

Inventors: Anai; Noriyuki (Kumamoto-ken, JP), Omori; Tsutae (Yamanashi-ken, JP), Takizawa; Masaaki (Kumamoto-ken, JP), Sakai; Mitsuhiro (Kumamoto-ken, JP)

Assignee: Tokyo Electron Ltd.

International Classification: B05D 1/00 (20060101); G03F 7/16 (20060101); H01L 21/00 (20060101); B05D 5/00 (20060101); B05D 001/40 ()

Expiration Date: 12/26/2013