Patent Number: 6,165,558

Title: Storage-stable moulding powder based on epoxy resins

Abstract: A moulding powder which is curable with the application of heat and pressure, comprising a mechanical mixture consisting of: a) a powdered epoxy compound containing on average more than one epoxy group in the molecule and having a softening point of above 60.degree. C., b) a powdered aliphatic or N-heterocyclic amine or a powdered amino group-containing adduct based on an aliphatic, cycloaliphatic, araliphatic or N-heterocyclic amine containing on average more than one amino group in the molecule and having a melting point or softening point of above 60.degree. C. and, optionally, c) customary additives for moulding powders, the particles of a) and b) being smaller than 200 .mu.m, is excellently suited for the preparation of coatings on heat-sensitive substrates and is used in particular in powder coating.

Inventors: Schneider; Hildegard (Steinen, DE)

Assignee: Vantico, Inc.

International Classification: C09D 163/00 (20060101); C08G 59/18 (20060101); C08G 59/00 (20060101); B05D 003/02 ()

Expiration Date: 12/26/2017