Patent Number: 6,165,595

Title: Component mounting board, process for producing the board, and process for producing the module

Abstract: A parts-packaging substrate comprising a metal wiring plate having a mask coated on its surface with several openings. This structure eliminates the need for a thick base formed of an insulating body and a resist layer required in prior art substrates. By bending a terminal of the metal wiring plate to form a connecting terminal, a connector used to connect to another substrate can be eliminated, reducing the cost of manufacture.

Inventors: Kumagai; Koichi (Ikoma, JP), Wada; Yoshinori (Moriguchi, JP), Edahiro; Teruki (Hirakata, JP)

Assignee: Matsushita Electric Industrial Co., Ltd.

International Classification: H05K 3/20 (20060101); H05K 3/28 (20060101); H05K 3/34 (20060101); H05K 1/00 (20060101); B32B 003/00 ()

Expiration Date: 12/26/2017