Patent Number: 6,165,596

Title: Multi-layer insulated metal substrate printed wiring board having improved thermal coupling of components

Abstract: An insulated metal substrate printed wiring board includes a thermally conductive base plate. A first dielectric layer is disposed on the base plate. An electrically conductive trace is disposed on the top surface of the first dielectric layer. A second dielectric layer is disposed on the top surface of the first electrically conductive trace. A second electrically conductive trace is disposed on the top surface of the second dielectric layer. The second dielectric layer and the second electrically conductive trace include an aperture to expose the electrically conductive trace disposed on the top surface of the first dielectric layer. High power dissipating components are mounted through the aperture in the second electrically conductive layer and second dielectric layer for electrical connection to the electrically conductive trace disposed on the top surface of the first dielectric layer. Similar construction can be extended to more than two layers of electrically conductive traces and the aperture is through all the layers except the first dielectric layer and the first electrically conductive layer.

Inventors: Chen; Shiaw-Jong (Plano, TX), Radke; Robert E. (Garland, TX)

Assignee: Lucent Technologies, Inc.

International Classification: H01L 23/34 (20060101); H01L 23/373 (20060101); H05K 1/18 (20060101); H05K 1/02 (20060101); H05K 7/20 (20060101); H05K 3/34 (20060101); H05K 1/00 (20060101); H05K 1/05 (20060101); B32B 003/00 (); H05K 001/03 (); H05K 001/11 (); H01L 023/02 ()

Expiration Date: 12/26/2017