Patent Number: 6,165,612

Title: Thermally conductive interface layers

Abstract: An improved interface pad or layer for use in combination with solid state electronic components adapted to be interposed along a heat dissipating path between the electronic device and a mounting chassis or heat-sink surface. The interface pads comprise a polyphenylsulfone binder or matrix blended with a particulate solid such as alumina, boron nitride, graphite, silicon carbide, diamond, metal powders, and mixtures or blends thereof. Advantageous formulations include up to 45% alumina. Another advantageous formulation includes between 10% and 20% by weight of boron nitride, balance polyphenylsulfone.

Inventors: Misra; Sanjay (Shoreview, MN)

Assignee: The Bergquist Company

International Classification: H01L 23/34 (20060101); C08L 81/06 (20060101); C08L 81/00 (20060101); H01L 23/373 (20060101); B32B 015/04 ()

Expiration Date: 12/26/2013