Patent Number: 6,165,613

Title: Adhesive paste for semiconductors

Abstract: This invention is an adhesive paste that consists essentially of a polymeric resin in particulate form and a carrier for the resin. The polymeric resin is present as particles with a particles size of 50 microns or smaller, is insoluble in the carrier at ambient temperature, and is soluble in the carrier at a temperature above ambient temperature. The carrier either reacts with the resin to form a covalent bond, or vaporizes from the adhesive paste, at a temperature above the temperature at which the resin is soluble in the carrier. The paste contains no inorganic fillers, holds its geometry on application, and fuses to a void-free bond.

Inventors: Puglisi; Christine (Mountainside, NJ), Krieger; Gregory (Somerville, NJ), Shenfield; David (Fountain Valley, CA), Kuder; Richard (Anaheim, CA), Xiao; Chaodong (East Hanover, NJ)

Assignee: National Starch and Chemical Investment Holding Corporation

International Classification: C09J 11/02 (20060101); C09J 11/06 (20060101); C09D 201/00 (20060101); H01L 21/02 (20060101); H01L 23/495 (20060101); H01L 23/48 (20060101); H01L 23/31 (20060101); H01L 21/58 (20060101); H01L 23/28 (20060101); B32B 015/04 (); B32B 007/12 (); C08K 003/10 ()

Expiration Date: 12/26/2017