Patent Number: 6,165,617

Title: Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil

Abstract: A resin-coated copper foil for use in a multilayer printed wiring board, characterized by having on one surface thereof a resin composition comprising, based on the total amount of the resin components, 50 to 90% by weight of epoxy resins, 5 to 20% by weight of a polyvinyl acetal resin, and 0.1 to 20% by weight of an urethane resin, with the proviso that 0.5 to 40% by weight of the epoxy resins is a rubber-modified epoxy resin; and a multilayer printed wiring board using the resin-coated copper foil therein.

Inventors: Satoh; Tetsurou (Saitama, JP), Tsuyoshi; Hiroaki (Omiya, JP), Hayasaka; Nobuo (Ageo, JP)

Assignee: Mitsui Mining & Smelting Co., Ltd.

International Classification: B32B 15/20 (20060101); B32B 15/08 (20060101); B32B 27/38 (20060101); C08L 63/00 (20060101); H05K 3/38 (20060101); H05K 3/46 (20060101); B32B 015/04 (); B32B 015/08 (); B32B 015/20 (); H05K 001/02 ()

Expiration Date: 12/26/2017