Patent Number: 6,165,629

Title: Structure for thin film interconnect

Abstract: This invention relates generally to a structure and process for thin film interconnect, and more particularly to a structure and process for a multilayer thin film interconnect structure with improved dimensional stability and electrical performance. The invention further relates to a process of fabrication of the multilayer thin film structures. The individual thin film structure is termed a compensator, and functions as both a ground/reference plane and as a stabilizing entity with regard to dimensional integrity. The compensator is comprised primarily of a metal sheet having a metallized via pattern and high-temperature stable polymer as an insulator.

Inventors: Sachdev; Krishna Gandhi (Hopewell Junction, NY), Kellner; Benedikt Maria Johannes (Wappingers Falls, NY), McGuire; Kathleen Mary (Wallkill, NY), Sorce; Peter Jerome (Poughkeepsie, NY)

Assignee: International Business Machines Corporation

International Classification: H01L 21/48 (20060101); H01L 21/02 (20060101); H01L 23/538 (20060101); H01L 23/52 (20060101); H05K 3/46 (20060101); H05K 3/44 (20060101); H05K 3/00 (20060101); H05K 3/42 (20060101); H05K 3/38 (20060101); H05K 3/40 (20060101); B32B 015/08 ()

Expiration Date: 12/26/2017