Patent Number:
6,165,678
Title:
Lithographic photoresist composition and process for its use in the manufacture of integrated circuits
Abstract:
A novel radiation-sensitive lithographic photoresist composition is provided which has improved sensitivity and resolution. The composition comprises a photosensitive acid generator and an acrylate or methacrylate copolymer. The copolymer contains first monomeric units having polar pendant groups and second monomeric units containing photoacid-cleavable ester groups. The polar pendant groups preferably comprise C.sub.6 -C.sub.12 alicyclic substituents containing a polar moiety R*, wherein the alicyclic substituents are bound through a linker moiety to the polymer backbone. Other monomeric units may be included as well. A process for using the composition to generate resist images on a substrate, i.e., in the manufacture of integrated circuits or the like.
Inventors:
Allen; Robert David (San Jose, CA), DiPietro; Richard Anthony (San Jose, CA), Sooriyakumaran; Ratnam (San Jose, CA), Wallow; Thomas I. (Union City, CA), Wallraff; Gregory Michael (Morgan Hill, CA)
Assignee:
International Business Machines Corporation
International Classification:
G03F 7/039 (20060101); G03F 7/004 (20060101); G03F 007/004 ()
Expiration Date:
12/26/2017
