Patent Number: 6,165,680

Title: Dissolution inhibitor of chemically amplified photoresist and chemically amplified photoresist composition containing the same

Abstract: A dissolution inhibitor for use in a chemically amplified photoresist, and a chemically amplified photoresist composition containing the same are provided. The dissolution inhibitor is a compound in which an acid-labile di-alkylmalonate group is combined as a functional group with a C.sub.1 to C.sub.20 hydrocarbon. The chemically amplified photoresist composition containing the dissolution inhibitor has a high contrast and high thermal decomposition temperature, making it suitable for forming a fine pattern having excellent profile.

Inventors: Choi; Sang-jun (Seoul, KR)

Assignee: Samsung Electronics Co., Ltd.

International Classification: G03F 7/004 (20060101); C07C 69/618 (20060101); C07C 69/00 (20060101); G03F 7/039 (20060101); G03F 007/004 ()

Expiration Date: 12/26/2013