Patent Number: 6,165,682

Title: Radiation sensitive copolymers, photoresist compositions thereof and deep UV bilayer systems thereof

Abstract: Radiation sensitive resins for use in a top layer resists in bilayer systems for use in deep UV photolithography comprises copolymers having the following structural units: ##STR1## and optionally, ##STR2## wherein n is an integer of 1 to 5, R.sup.1 is methyl or trimethylsiloxy, R.sup.2 is a tert-butyl group, R.sup.3, R.sup.4 and R.sup.5 are each independently hydrogen or a methyl group.

Inventors: Foster; Patrick (Providence, RI), Biafore; John Joseph (Providence, RI), Spaziano; Gregory Domenic (Providence, RI)

Assignee: Arch Specialty Chemicals, Inc.

International Classification: G03F 7/09 (20060101); G03F 7/075 (20060101); G03F 7/039 (20060101); G03F 007/004 ()

Expiration Date: 12/26/2013