Patent Number: 6,165,887

Title: Method of improving interconnect of semiconductor devices by using a flattened ball bond

Abstract: A method of forming a semiconductor device assembly comprising forming a wire bump on at least one bond pad on the active surface of a semiconductor device and connecting one end of a wire to the wire bump using a wire bond. The wire bump may be flattened before connecting one end of a wire thereto.

Inventors: Ball; Michael B. (Boise, ID)

Assignee: Micron Technology , Inc.

International Classification: H01L 21/02 (20060101); H01L 21/607 (20060101); H01L 021/44 ()

Expiration Date: 12/26/2017