Patent Number: 6,165,888

Title: Two step wire bond process

Abstract: A two step wire bonding process is used to ultrasonically attach a wire (18) to a contact pad (13) on a semiconductor device (10). A first step is used to flatten a rounded tip (19) of the wire (18), and to start the bonding process. This is accomplished by applying a relatively large force to the rounded tip (19), and a relatively low vibrating displacement to the flattened wire tip (19). During a second step the large force is reduced, however; the vibrating displacement is increased. The total time for the two step wire bonding process is slightly less than a prior art one step process.

Inventors: Kwon; Seok Mo (Kyongggi-do, KR), Choe; Si Hyun (Kyongggi-do, KR)

Assignee: Motorola, Inc.

International Classification: H01L 21/60 (20060101); H01L 21/02 (20060101); H01L 21/607 (20060101); H01L 021/44 ()

Expiration Date: 12/26/2013