Patent Number: 6,166,131

Title: Highly reactive modified phenolic resin and molding material for electrical/electronic parts and semiconductor sealing material

Abstract: Disclosed is a process for producing a highly reactive modified phenolic resin, which comprises mixing a heavy oil or pitch with 0.3 to 10 mol of a phenol, 0.2 to 9 mol in terms of formaldehyde, of a formaldehyde compound and 0.01 to 3.0 mol of an acid catalyst, each amount being based on 1 mol of the heavy oil or pitch calculated from an average molecular weight; and heating the resulting mixture with stirring, thereby to polycondensate the heavy oil or pitch, phenol and formaldehyde compound. According to this invention, there can be provided a process for producing simply and stably a highly reactive modified phenolic resin having low melt viscosity, excellent heat resistance and high reactivity with an epoxy resin, in one step.

Inventors: Tashima; Masao (Kamisu-machi, JP), Miyasita; Hiromi (Kamisu-machi, JP), Takeda; Haruhiko (Kamisu-machi, JP), Fujii; Tomoaki (Kamisu-machi, JP), Ishizuka; Tatsushi (Kamisu-machi, JP), Hasegawa; Makoto (Kamisu-machi, JP)

Assignee: Kashima Oil Co., Ltd.

International Classification: C08L 61/14 (20060101); C08L 61/00 (20060101); C08G 8/28 (20060101); C08L 61/06 (20060101); C08G 8/00 (20060101); H01B 3/36 (20060101); C08G 063/48 (); C08G 063/91 ()

Expiration Date: 12/26/2017