Patent Number: 6,166,146

Title: Curable resin composition, adhesive composition, bonded product, speaker and bonding method

Abstract: A curable resin composition comprising (1) a polymerizable vinyl monomer, (2) a polymerization initiator, (3) an aromatic amine and/or a pyridine derivative, (4) a .beta.-diketone chelate and/or a .beta.-keto-ester, and (5) a phosphate.

Inventors: Suto; Hiroshi (Shibukawa, JP), Taguchi; Koichi (Shibukawa, JP)

Assignee: Denki Kagaku Kogyo Kabushiki Kaisha

International Classification: C09J 4/00 (20060101); H04R 9/00 (20060101); H04R 9/06 (20060101); C08L 051/00 (); C08L 051/04 (); C08L 033/08 (); C09J 004/02 (); C09J 004/06 ()

Expiration Date: 12/26/2017