Patent Number: 6,166,171

Title: Polyamide resin composition

Abstract: A polyamide resin composition comprising 100 parts by weight of a polyamide resin and 0.005 to 1.0 part by weight of at least one compound selected from the group consisting of a metal salt of a fatty acid, a diamide compound and a diester compound. The polyamide resin is obtained by solid phase-polymerizing a polyamide resin prepared by melt-polymerizing a diamine component containing 70 mol % or more of metaxylylenediamine and a dicarboxylic acid component containing 70 mol % or more of adipic acid, and preferably has a relative viscosity of 2.3 to 4.2 when measured at C. using a solution of 1 g polyamide resin in 100 ml of 96% sulfuric acid. By adding at least one compound selected from the group consisting of the specific metal salt of fatty acid, the diamide compound and the diester compound to a solid phase-polymerized polyamide resin, shaped articles such as films, sheets and hollow containers made of the solid phase-polymerized polyamide are improved in the resistance to whitening during storage tinder a high humid condition, upon contacting with water or boiling water, or upon heating to a glass transition temperature or higher.

Inventors: Yamamoto; Koji (Kanagawa-ken, JP), Takahashi; Makoto (Kanagawa-ken, JP), Shimazaki; Hisashi (Kanagawa-ken, JP), Maruyama; Katsuya (Kanagawa-ken, JP)

Assignee: Mitsubishi Gas Chemical Company, Inc.

International Classification: C08G 69/30 (20060101); C08G 69/00 (20060101); C08K 5/098 (20060101); C08G 69/48 (20060101); C08K 5/20 (20060101); C08K 5/00 (20060101); C08G 073/10 (); B32B 027/00 (); C08L 077/00 ()

Expiration Date: 12/26/2017