Patent Number: 6,166,322

Title: Encapulation process for mono-and polycrystalline silicon solar cell modules

Abstract: A crystalline silicon based solar cell module comprising: (a) a crystalline silicon based solar cell array formed by interconnecting a plurality of crystalline silicon based solar cells with an interconnect; (b) a hot melt adhesive applied above and below the interconnect to reduce mechanical and thermal stress between the interconnect and the crystalline silicon based solar cells. The hot melt adhesive can be an ethylene-polymer along with a variety of additives such as oxidation inhibitor, UV stabilizer, and UV absorber.

Inventors: Chen; Chih-Chiang (Hsinchu, TW), Pan; Jing-Pin (Hsinchu, TW)

Assignee: Industrial Technology Research Institute

International Classification: H01L 31/048 (20060101); H01L 31/05 (20060101); H01L 031/048 (); H01L 031/05 ()

Expiration Date: 12/26/2017