Patent Number: 6,166,324

Title: PC card housing with insulative cover and ground feature

Abstract: A card housing for printed circuit boards, wherein the card housing is provided with stamped covers having grounding members extending unitarily therefrom, wherein at least one grounding member is bent so that an outward surface of the grounding member is contiguous with an outward face of the cover. The cover having the bent grounding member is stamped from a metallic sheet having an insulative frame on one side that forms the outward face and surface. An insulative frame overlays a peripheral edge of each cover so that the two covers may be sealed to encase a printed circuit board inserted therein.

Inventors: Oldendorf; John (Prospect Heights, IL), Weibezahn; Brandt (San Ramon, CA), Allen; Jeffrey (Plesanton, CA)

Assignee: Methode Electronics, Inc.

International Classification: H05K 5/02 (20060101); H05K 009/00 ()

Expiration Date: 12/26/2017