Patent Number: 6,166,333

Title: Bumps with plural under-bump dielectric layers

Abstract: The present invention includes composite support substrate for both flexible and rigid board circuit applications and method of making the same. The composite substrate is composed of at least two materials formed under the circuitry. A first material is a conventional matrix such as a polyimide/acrylic adhesive, and a second material having unique properties that are useful locally in isolated locations. For instance, the second material may be nonporous to moisture, optically clear, and/or thermally conductive. The second material is integrated into the circuit matrix at specific localized areas where desired with portions coplanar with the first material so that circuit traces remain continuous as they pass from the first material to the second. For example, an integrated circuit chip may be isolated from the polyimide matrix, which is porous in moisture, by using the second material that is nonporous to moisture at locations where the integrated circuit chip is to be attached, thus isolating the integrated circuit chip from the polyimide and preventing moisture from flowing through to the chip.

Inventors: Crumly; William R. (Anaheim, CA), Feigenbaum; Haim (Irvine, CA)

Assignee: Packard Hughes Interconnect Company

International Classification: H01L 21/48 (20060101); H01L 21/02 (20060101); H01L 23/48 (20060101); H01L 23/498 (20060101); H01L 23/12 (20060101); H01L 23/14 (20060101); H01L 21/60 (20060101); H01L 23/13 (20060101); H01L 23/15 (20060101); H05K 3/40 (20060101); H05K 3/20 (20060101); H05K 3/00 (20060101); H05K 001/03 ()

Expiration Date: 12/26/2017