Patent Number: 6,166,334

Title: Plating process for fine pitch die in wafer form

Abstract: Apertures in a tape formed on a substrate allow straight plating of solder bumps to heights above 4 mils. The solder bumps are combined with a lower density material to form an hourglass-shaped structure which allows interconnections to bonding pads of electronic components with pitches less than 9 mils.

Inventors: Galloway; Terry R. (San Jose, CA)

Assignee: Integrated Device Technology, Inc.

International Classification: B23K 3/06 (20060101); H05K 3/34 (20060101); H05K 3/00 (20060101); H01R 012/04 (); H05K 001/11 ()

Expiration Date: 12/26/2013