Patent Number: 6,166,356

Title: Temperature monitoring system

Abstract: An embodiment of a temperature monitoring system can be used to determine the temperatures of assemblies in an apparatus. The embodiment of the temperature monitoring system includes a sensor that can measure different types of gaseous molecules. The embodiment of the temperature monitoring system further includes a monitoring device coupled to the sensor to generate parameters based upon the quantities of the different types of gaseous molecules emitted by the assemblies. A controller coupled to the monitoring device determines the temperatures of the assemblies using the parameters generated by the monitoring device. If the controller determines that the temperatures of one or more of the assemblies exceeds a maximum desired operating temperature, the controller reduces the amount of energy dissipated in the assemblies to reduce the temperatures of the assemblies.

Inventors: Carlson; Gerard J. (Boise, ID)

Assignee: Hewlett-Packard

International Classification: H05K 7/20 (20060101); H05B 001/02 (); G01N 030/96 ()

Expiration Date: 12/26/2017