Patent Number: 6,166,403

Title: Integrated circuit having embedded memory with electromagnetic shield

Abstract: An integrated circuit including a substrate having a memory area and a non-memory area. An embedded memory is fabricated on the substrate within the memory area. First and second semiconductor cells are fabricated on the substrate within the non-memory area. An electromagnetic shield covers substantially memory area. A routing layer is fabricated over the memory and non-memory areas and over the electromagnetic shield. A signal wire is electrically coupled between the first and second semiconductor cells and has a conductive segment which is routed within the routing layer and extends over the memory area.

Inventors: Castagnetti; Ruggero (San Jose, CA), Liu; Yauh-Ching (Sunnyvale, CA), Ramesh; Subramanian (Cupertino, CA)

Assignee: LSI Logic Corporation

International Classification: H01L 23/60 (20060101); H01L 23/552 (20060101); H01L 23/58 (20060101); H01L 27/105 (20060101); H01L 027/10 (); H01L 029/00 (); H01L 023/48 ()

Expiration Date: 12/26/2017