Patent Number: 6,166,414

Title: Electronic circuit

Abstract: An electronic circuit formed on an insulating substrate and having thin-film transistors (TFTs) comprising semiconductor layers. The thickness of the semiconductor layers is less than 1500 .ANG., e.g., between 100 and 750 .ANG.. A first layer consisting mainly of titanium and nitrogen is formed on the semiconductor layer. A second layer consisting aluminum is formed on top of the first layer. The first and second layers are patterned into conductive interconnects. The bottom surface of the second layer is substantially totally in intimate contact with the first layer. The interconnects have good contacts with the semiconductor layer.

Inventors: Miyazaki; Minoru (Kanagawa, JP), Murakami; Akane (Kanagawa, JP), Cui; Baochun (Kanagawa, JP), Yamamoto; Mutsuo (Kanagawa, JP)

Assignee: Semiconductor Energy Laboratory Co., Ltd.

International Classification: H01L 21/70 (20060101); H01L 29/45 (20060101); H01L 27/12 (20060101); H01L 29/40 (20060101); H01L 23/52 (20060101); H01L 23/532 (20060101); H01L 21/84 (20060101); G02F 1/13 (20060101); G02F 1/1368 (20060101); H01L 029/76 (); H01L 029/94 (); H01L 031/062 (); H01L 031/113 (); H01L 031/119 ()

Expiration Date: 12/26/2017