Patent Number: 6,166,429

Title: Lead-frame package with shield means between signal terminal electrodes

Abstract: A semiconductor device has the following structure: a lead frame 2 is disposed on the center of a package 1, signal terminal electrodes 3 through 7 are disposed on edges of the package, a semiconductor chip 8 is mounted on the lead frame 2, a grounding electrode 16 having a grounding potential is disposed between the signal terminal electrodes 4 and 5, and a grounding electrode having a grounding potential is disposed between the signal terminal electrodes 5 and 6. This structure increases an electrical separation between the signal terminal electrodes.

Inventors: Ishida; Hidetoshi (Kyoto, JP), Miyatsuji; Kazuo (Settsu, JP), Ueda; Daisuke (ibaraki, JP)

Assignee: Matsushita Electronics Corporation

International Classification: H01L 23/48 (20060101); H01L 23/495 (20060101); H01L 23/522 (20060101); H01L 23/52 (20060101); H01L 023/48 (); H01L 023/495 ()

Expiration Date: 12/26/2017