Patent Number: 6,166,430

Title: Lead frame, method for manufacturing the frame, resin-molded semiconductor device and method for manufacturing the device

Abstract: The lead frame of the present invention includes: an outer frame having an opening; a plurality of leads consisting of outer and signal-connecting leads and extending inside the opening from the outer frame toward a region in which the semiconductor chip is mounted; a die pad disposed inside the opening; and a plastic film adhered to respective lower surfaces of the die pad, the outer frame and the signal-connecting leads. This lead frame is not provided with support leads and the die pad is indirectly supported by the outer frame with the plastic film. Since no support leads are provided, the size of an installable semiconductor chip can be enlarged and the overall size of a semiconductor device can be reduced.

Inventors: Yamaguchi; Yukio (Shiga, JP)

Assignee: Matsushita Electronics Corporation

International Classification: H01L 23/48 (20060101); H01L 23/31 (20060101); H01L 23/495 (20060101); H01L 23/28 (20060101); H01L 023/495 ()

Expiration Date: 12/26/2017