Patent Number: 6,166,431

Title: Semiconductor device with a thickness of 1 MM or less

Abstract: A semiconductor device with a thickness of 1 mm or less is disclosed, that comprises a frame plate main body with a thickness in the range from 0.1 mm to 0.25 mm, a semiconductor pellet disposed on a first surface of the frame plate main body and with a thickness in the range from 0.2 mm to 0.3 mm, an external connection lead, one end thereof being connected to a peripheral portion of the first surface of the frame plate main body, the other end thereof extending to the outside of the frame plate main body, a bonding wire for electrically connecting an electrode of the semiconductor pellet and a connection portion of the end of the external connection lead, and a sealing resin layer for covering and sealing at least a region including the semiconductor pellet, the bonding wire, and a connection portion.

Inventors: Ohmori; Jun (Yokohama, JP), Iwasaki; Hiroshi (Yokohama, JP), Takahashi; Takuya (Yokohama, JP), Jin; Takanori (Yokohama, JP), Fukuda; Masatoshi (Yokohama, JP)

Assignee: Kabushiki Kaisha Tishiba

International Classification: H01L 23/48 (20060101); H01L 23/498 (20060101); H01L 23/31 (20060101); H01L 23/495 (20060101); H01L 23/28 (20060101); H01C 023/02 (); H01C 023/053 ()

Expiration Date: 12/26/2017