Patent Number: 6,166,434

Title: Die clip assembly for semiconductor package

Abstract: Provided is a die clip for use in semiconductor flip chip packaging as a replacement for the conventional combination of a heat spreader and stiffener, a packaging method using the die clip, and a semiconductor package incorporating the die clip. In a preferred embodiment, the die clip is a piece of high modulus, high thermal conductivity material shaped to attach over a die on the surface of a packaging substrate. The die clip closely engages the die while leaving some space open around the perimeter to provide access to the die. An underfill material may then be dispensed into the gap between the die and the substrate through an opening in the die clip. The underfill material is then cured, the die clip providing a heat sink and keeping the die and substrate flat and immobile during and after the curing process. A BGA process may then be used to apply solder balls to the underside of the substrate for subsequent bonding of the package to a circuit board for use.

Inventors: Desai; Kishor V. (Livermore, CA), Patel; Sunil A. (Los Altos, CA), McCormick; John P. (Palo Alto, CA)

Assignee: LSI Logic Corporation

International Classification: H01L 21/02 (20060101); H01L 21/56 (20060101); H01L 23/04 (20060101); H01L 23/02 (20060101); H01L 023/12 ()

Expiration Date: 12/26/2017