Patent Number: 6,166,552

Title: Method and apparatus for testing a semiconductor wafer

Abstract: A probing apparatus includes a prober (210) and a test head (130) that includes a test head mother board (132). A load board 218 and a probe card (216) are connect to each other and the test head mother board (132) using conductive bumps (219). The need for a table top for the prober (210) and clamp ring are essentially eliminated. The direct docking of the test head mother board (132) to the probe card and load board assembly allows more reliable and shorter connections to be made. A tilt controller (324) and theta controller (624) allow fine adjustments to be made.

Inventors: O'Connell; Richard W. (Austin, TX)

Assignee: Motorola Inc.

International Classification: G01R 31/28 (20060101); G01R 031/00 ()

Expiration Date: 12/26/2013