Patent Number: 6,166,556

Title: Method for testing a semiconductor device and semiconductor device tested thereby

Abstract: A test substrate (30) including a plurality of solder bumps (38) is used to test a die (10) which can be used as either a wire-bonded device or a flip-chip device. Die (10) includes test pads (14) which are redundant electrical connections to bond pads (12). The solder bumps make contact with the test pads of the device during testing. On separating the test substrate and die, the bumps remain on the test substrate if the die is to be wire bonded, or are transferred to the die if the die is to be flip-chip mounted to a next-level package substrate. Whether the bumps are transferred or not is determined by the relative areas of the solder receiving pads/studs (26 and 36) on the test substrate die. Common process flows and even die layouts can be used for the two different device types, thereby saving manufacturing and design costs.

Inventors: Wang; James (Berlin, DE), Rutledge; James L. (Austin, TX), Kaskoun; Kenneth (Berlin, DE)

Assignee: Motorola, Inc.

International Classification: G01R 1/073 (20060101); G01R 031/26 (); G01R 031/02 ()

Expiration Date: 12/26/2017