Patent Number: 6,166,620

Title: Resistance wiring board and method for manufacturing the same

Abstract: A resistance wiring board having a cavity disposed on an insulated substrate, a resistance disposed in the cavity, a protective film disposed on a top face of the resistance, and electrodes electrically connected at near both ends of the resistance, wherein surfaces of the electrodes and a surface of the protective film are the same level as or lower than a surface of the wiring board. A method for manufacturing a resistance wiring board comprising the steps of forming a green sheet, forming an electrode pattern on the green sheet, forming a dented pattern on the green sheet, firing the green sheet, forming a resistance by filling a resistance material in the dent of the green sheet, and forming a protective film on a top face of the resistance.

Inventors: Inuzuka; Tsutomu (Osaka, JP), Tomioka; Satoshi (Osaka, JP), Furukawa; Shigeo (Osaka, JP), Himori; Tsuyoshi (Osaka, JP), Kimura; Suzushi (Osaka, JP)

Assignee: Matsushita Electric Industrial Co., Ltd.

International Classification: H01C 7/00 (20060101); H01C 17/06 (20060101); H01C 1/01 (20060101); H01C 1/012 (20060101); H01C 17/065 (20060101); H01C 001/012 ()

Expiration Date: 12/26/2017