Patent Number: 6,166,646

Title: Vacuum-adsorbing apparatus of semiconductor device fabrication facility

Abstract: A vacuum adsorbing apparatus of a semiconductor fabrication facility is characterized by the incorporation of a digital vacuum sensor into the vacuum line for sensing the mounting state of a wafer or reticle on a mounting plate (adhered to or released by) by way of sensing the pressure existing in the vacuum line. The digital sensor reliably determines the state of the wafer or the reticle relative to the mounting plate. The mounting plate can thus be prevented from being transferred when the vacuum in the mounting plate is insufficient to adhere the wafer or reticle firmly to the plate. The wafer or the reticle can thus be prevented from being damaged or broken during its transfer.

Inventors: Park; Soon-jong (Kyungki-do, KR), Lyu; Ki-man (Kyungki-do, KR)

Assignee: Samsung Electronics Co., Ltd.

International Classification: H01L 21/683 (20060101); H01L 21/67 (20060101); H01L 21/00 (20060101); G08B 021/00 ()

Expiration Date: 12/26/2013