Patent Number: 6,166,906

Title: Heat-dissipating module for an electronic device

Abstract: A heat-dissipating module for dissipating heat generated by an electronic component includes a fan base formed with a fan mounting cavity, a heat-dissipating fan mounted in the fan mounting cavity, a heat-conducting plate adapted to contact a heat-dissipating side of the electronic component, and a connecting shaft having a mounting section that is mounted on the heat-conducting plate and a pivot section that extends from the mounting section and that is mounted pivotally on the fan base, thereby permitting movement of the heat-conducting plate toward and away from the heat-dissipating side of the electronic component.

Inventors: Sun; Ming-Shen (Taipei, TW), Lu; Shao-Pai (Taipei, TW)

Assignee: Compal Electronics, Inc

International Classification: H05K 7/20 (20060101); H05K 007/20 ()

Expiration Date: 12/26/2017