Patent Number: 6,166,908

Title: Integrated circuit cartridge

Abstract: An integrated circuit cartridge has been described. The cartridge includes a heat pipe lid that comes in thermal contact with at least one integrated circuit die. The integrated circuit die is mounted on a substrate that is held in a cavity of a pin chassis that has a grid array of pins for interconnection with a socket. The integrated circuit die can be mounted on a secondary substrate that is mounted to a primary substrate. The substrate has an edge connector to supply power to the integrated circuit die, freeing the grid array of pins to be used for signal interconnects. The substrate has a grid of connections soldered to the grid array of pins on the pin chassis. The pin chassis also supplies key structures that aid in alignment of the pins and a socket.

Inventors: Samaras; Bill (San Jose, CA), Brownell; Michael (Los Gatos, CA), McCutchan; Dan R. (Redwood City, CA), Xie; Hong (Phoenix, AZ)

Assignee: Intel Corporation

International Classification: H05K 5/02 (20060101); H05K 7/20 (20060101); H05K 007/20 ()

Expiration Date: 12/26/2017