Patent Number: 6,166,911

Title: Semiconductor integrated circuit card assembly

Abstract: Provided is a semiconductor assembly, comprising a circuit board (1) including a conductor circuit (4), the conductor circuit including connecting pads, a semiconductor chip (2) provided with connecting terminals provided on a first surface thereof, and mounted on the circuit board, a casing (5) covering the circuit board, wherein the connecting pads of the conductor circuit and the connecting terminals of the semiconductor chip are disposed in mutually opposing relationship, and are connected with each other by an electroconductive bonding agent, a neutral plane of the semiconductor chip substantially coinciding with an overall neutral plane of the semiconductor assembly.

Inventors: Usami; Mitsuo (Akishima, JP), Nishi; Kunihiko (Kokubunji, JP), Mikami; Yoshikatsu (Shimodate, JP), Suzuki; Masakatsu (Ibaraki, JP)

Assignee: Hitachi, Ltd.

International Classification: H01L 23/48 (20060101); H01L 23/498 (20060101); H01L 23/64 (20060101); H01L 25/16 (20060101); G06K 19/077 (20060101); H01L 23/58 (20060101); H05K 007/14 (); H01Q 001/36 (); G06K 019/02 ()

Expiration Date: 12/26/2013