Patent Number: 6,166,915

Title: Electronic circuits and circuit boards

Abstract: A method of forming a circuit board includes, a) providing a temporary substrate; b) depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate; c) substantially curing the uncured circuit board material into at least one self supporting sheet; d) providing circuit traces atop the cured self supporting sheet; e) mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and f) peeling the temporary substrate and cured self supporting sheet from one another. An electronic circuit of the invention includes, i) a self-supporting electrically insulative ink or paint substrate, the ink or paint substrate having an outer surface; ii) circuit traces provided on the ink or paint substrate outer surface; and iii) at least one electronic circuit component mounted to the ink or paint substrate outer surface in electrical connection with the circuit traces.

Inventors: Lake; Rickie C. (Eagle, ID), Mousseau; Joe (Boise, ID), Tuttle; Mark E. (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: H01L 21/67 (20060101); H01L 23/498 (20060101); H01L 23/48 (20060101); H01L 23/31 (20060101); H01L 21/68 (20060101); H01L 23/28 (20060101); H05K 3/00 (20060101); H05K 3/28 (20060101); H05K 1/00 (20060101); H05K 001/03 ()

Expiration Date: 12/26/2017