Patent Number: 6,166,919

Title: Casing mountable filler module

Abstract: A filler module is slidably mountable in an otherwise unused slot of a multi-slot, multi-module electronic system housed in a casing. The filler module includes a relatively compact housing which engages an EMI gasket and an electric connector in an unused slot at the backplane of a shelf in the casing. The module also includes a non-conductive, rigid extension element which facilitates air flow between adjacent modules within the rack. The extension element may include electrically conductive strips which provide ESD protection during the insertion of the module through intimate contact with a grounded, resilient contacting surface. The module may also comprise a non-conductive bulkhead with pivoted latches which engage the casing to secure the housing to the backplane. In this way, a filler module is achieved in which EMI containment is accomplished in a modular fashion and air flow is maintained in the shelf independent of the number or position of used and unused slots. Modular EMI containment is particularly well suited for use in high speed (e.g., 2.5 to 10 GHz) electronic systems such as synchronous optical network transport nodes.

Inventors: Nicolici; Radu-Marko (Ottawa, CA), Barber; Robert J. (Carleton Place, CA), Weber; John F. (Ottawa, CA)

Assignee: Notrel Networks Corporation

International Classification: H05K 7/14 (20060101); H05K 9/00 (20060101); H05K 009/00 ()

Expiration Date: 12/26/2017