Patent Number: 6,167,583

Title: Double side cleaning apparatus for semiconductor substrate

Abstract: A double side cleaning apparatus includes a pair of roll-like brushes and at least one cleaning brush. The roll-like brushes are driven to rotate in opposite directions, and a semiconductor wafer is arranged between them in a non-contact manner. The cleaning brush is arranged near the pair of roll-like brushes. While the semiconductor wafer is arranged between the pair of roll-like brushes and its upper and lower surfaces are being cleaned, the cleaning brush brushes the side surface of the semiconductor wafer. A cleaning agent is supplied from the pair of roll-like brushes to the semiconductor wafer to clean it. Since the upper and lower surfaces of the semiconductor wafer are cleaned in a non-contact manner, dust can be removed efficiently (within a short period of time and a small space).

Inventors: Miyashita; Naoto (Yokohama, JP), Abe; Masahiro (Yokohama, JP)

Assignee: Kabushiki Kaisha Toshiba

International Classification: B08B 1/04 (20060101); H01L 21/00 (20060101); B08B 003/02 ()

Expiration Date: 01/02/2018