Patent Number: 6,167,614

Title: Method of manufacturing and testing an electronic device, and an electronic device

Abstract: A method of manufacturing and testing an electronic circuit, the method comprising forming a plurality of conductive traces on a substrate and providing a gap in one of the conductive traces; attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces; supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and employing a jumper to electrically close the gap, and complete the circuit, after verifying electrical connections. An electronic circuit comprising a substrate; a plurality of conductive traces on the substrate, with a gap in one of the conductive traces; a circuit component attached to the substrate and coupled to at least one of the conductive traces; a battery supported on the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; and a jumper electrically closing the gap and completing the circuit, the jumper comprising conductive epoxy.

Inventors: Tuttle; Mark E. (Boise, ID), Lake; Rickie C. (Eagle, ID), Medlen; Curtis M. (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: G01R 31/02 (20060101); G01R 31/04 (20060101); H05K 1/00 (20060101); H05K 7/20 (20060101); H05K 3/32 (20060101); H05K 1/02 (20060101); H05K 003/30 ()

Expiration Date: 01/02/2018