Patent Number: 6,167,615

Title: Method for producing circuit board assemblies using surface mount components with finely spaced leads

Abstract: Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.

Inventors: Ma; Bao-Tong (Hong Kong, HK), Sarkhel; Amit Kumar (Endicott, NY), Seto; Ping Kwong (Madison, AL)

Assignee: International Business Machines Corporation

International Classification: H05K 3/34 (20060101); H05K 1/11 (20060101); H05K 3/12 (20060101); H05K 003/34 ()

Expiration Date: 01/02/2018