Patent Number: 6,167,893

Title: Dynamic chuck for semiconductor wafer or other substrate

Abstract: A dynamic chuck for holding a semiconductor wafer or other substrate includes a plurality of clamping arms mounted radially about a central axis of rotation of the wafer or other substrate. Each of the arms is mounted such that it is free to pivot about a horizontal axis. As the chuck rotates the substrate, a centrifugal force acts on each of the arms, causing it to pivot about its axis of rotation and thereby forcing a holding surface of the arm against a peripheral edge of the substrate. The dynamic chuck is applicable to any type of device in which a semiconductor wafer or other substrate must be held in a centered positioned while it is being spun, including wafer cleaning and rinsing apparatus.

Inventors: Taatjes; Steven W. (West Linn, OR), Ostrowski; John F. (Hillsboro, OR)

Assignee: Novellus Systems, Inc.

International Classification: H01L 21/67 (20060101); H01L 21/687 (20060101); B08B 003/02 ()

Expiration Date: 01/02/2018