Patent Number: 6,167,947

Title: High performance gas cooling system and method

Abstract: The present invention relates to an improved system and method for cooling electronic devices. The present system is particularly adapted for cooling computer equipment. The system comprises a sealed enclosure which houses one or more heat generating electronic devices; a blower; and a heat exchanger. The sealed enclosure may be pressurized with a gas medium such as dry nitrogen up to a pressure of approximately two atmospheres. The elevated pressure increases the gas density, effectively increasing the mass flow rate and heat carrying capacity of the gas. The blower is also a constant volume device such that it can move the same volume of gas regardless of density. Accordingly, for a given heat load, the size of the blower may be reduced. Or, alternatively, a given blower can cool a device having a higher heat load. Finally, by pressurizing the enclosure, the present invention eliminates the need to size a forced air cooling system based on high elevation requirements.

Inventors: Hokanson; Karl (Coon Rapids, MN), Carlson; Douglas M. (Eau Claire, WI), Berg; William (Eau Claire, WI)

Assignee: Silicon Graphics, Inc.

International Classification: G06F 1/20 (20060101); H05K 7/20 (20060101); F28F 007/00 (); F24H 003/06 (); H05K 007/20 ()

Expiration Date: 01/02/2018