Patent Number: 6,167,949

Title: Low EMI emissions heat sink device

Abstract: A low electro-magnetic radiation emissions heat sink that dissipates heat away from an integrated circuit package by means of conduction to the electronic chassis. The heat sink may also include a ferrite ring for reducing electro-magnetic radiation emissions from the integrated circuit package by increasing the electrical impedance of the EMI transmission path between the integrated circuit package and the electronic chassis, thus reducing the capacitive coupling and RFI concerns of conductive heat dissipation. The heat sink of the present invention may also include fins that are external to the electronic chassis for greater heat dissipation by means of external air convection.

Inventors: Langley; Philip David (Granite Bay, CA), Boone; Douglas (Newcastle, CA)

Assignee: Hewlett-Packard Company

International Classification: H01L 23/34 (20060101); H01L 23/552 (20060101); H01L 23/373 (20060101); H01L 23/367 (20060101); H05K 9/00 (20060101); H05K 7/20 (20060101); F28D 015/00 ()

Expiration Date: 01/02/2018