Patent Number: 6,167,955

Title: Multi-mode heat transfer using a thermal heat pipe valve

Abstract: An electronic device has a heat pipe containing a heat transfer fluid. The heat pipe has a first section and a second section. Inside the heat pipe is a valve disposed between the first section and second section of the heat pipe. The valve has an actuator that is used to regulate the flow of the heat transfer fluid between the first section and the second section of the heat pipe in response to a changed state detected by a sensor.

Inventors: Van Brocklin; Andrew L. (Corvallis, OR), Bausch; James F. (Salem, OR), Sterner; John R. (Albany, OR)

Assignee: Hewlett-Packard Company

International Classification: G06F 1/20 (20060101); F28D 15/06 (20060101); H05K 7/20 (20060101); F28F 027/00 ()

Expiration Date: 01/02/2018