Patent Number: 6,168,025

Title: Wafer holding structure for semiconductor wafer containers

Abstract: A holding blade is formed to be separated from a neighboring holding blades. A body of an elastic plate is separated from bodies of neighboring elastic plates. Each elastic plate base is integrally formed and connected with each corresponding elastic plate body. The thickness of the elastic plate gradually decreases from the junction between the elastic plate base and the frame portion toward its top end. The surface of the elastic plate is shaped in a curved manner. The cross-section of the elastic plate body is substantially rectangular in shape with a larger width in the horizontal direction, and terrace portion extends outward from the elastic plate body.

Inventors: Sakurai; Youichi (Kanagawa, JP), Miyahara; Ryou (Kanagawa, JP), Ichino; Ryousei (Tokyo, JP), Nakai; Akira (Tokyo, JP)

Assignee: Komatsu Electronic Metals Co., Ltd.

International Classification: H01L 21/67 (20060101); H01L 21/673 (20060101); B65D 085/30 ()

Expiration Date: 01/02/2018