Patent Number: 6,168,063

Title: Ultrasonic vibration bonding machine

Abstract: An ultrasonic vibration bonding machine which can simplify a suction passage structure. A resonator has a suction passage at the maximum vibration amplitude point where a bonding working portion is provided, the positions of the pads of a circuit board mounted on a mounting unit and the positions of the pads of a semiconductor chip absorbed and adsorbed to the bonding working portion are measured to align the pads accurately, and then the pads are bonded together.

Inventors: Sato; Shigeru (Fukuoka-ken, JP), Nakai; Seiya (Fukuoka-ken, JP)

Assignee: Ultex Corporation

International Classification: B23K 20/10 (20060101); H01L 21/00 (20060101); B23K 001/06 (); B23K 001/00 (); B23K 001/14 (); B23K 005/00 (); B23K 037/04 ()

Expiration Date: 01/02/2018