Patent Number: 6,168,068

Title: Method for preventing a gold plate connector on a PCB from being contaminated

Abstract: Disclosed is a method of preventing a gold plate connector of a printed circuit board (PCB) from being contaminated during a soldering process. The disclosed method prevents the gold plate connector coupled with the printed circuit board from being contaminated during wave soldering of the printed circuit board after spreading flux over the printed circuit board on which electronic components are mounted, and the method includes the steps of: forming a strip mask in a form of a membrane by solidifying a masking solution after spreading the masking solution capable of being solidified over the gold plate connector of the printed circuit board, performing the spreading of the masking solution before the spreading of the flux; and removing the strip mask from the gold plate connector after performing the wave soldering. As a result, it is not necessary to perform a washing operation of the gold plate connector. The washing operation can be troublesome, time-consuming, and inconvenient. The present invention causes the time required for performing an entire process upon the printed circuit board to be shortened, and productivity and efficiency to be enhanced.

Inventors: Lee; Gun-Yong (Suwon, KR), Tsukue; Masaharu (Suwon, KR), Kim; Choul-Su (Suwon, KR)

Assignee: Samsung Electronic Co, Ltd.

International Classification: B23K 1/08 (20060101); B23K 3/08 (20060101); B23K 3/00 (20060101); B23K 35/22 (20060101); H05K 3/34 (20060101); H05K 1/11 (20060101); B23K 001/20 (); B23K 031/00 (); B23K 031/02 (); B23K 035/38 ()

Expiration Date: 01/02/2018