Patent Number: 6,168,461

Title: Module jack arrangement

Abstract: A module jack arrangement, which includes multiple module jacks coupled into a row, and at least one clip respectively installed in each two adjacent module jacks to secure the module jacks in position, each module jack including a housing, a terminal holder fastened to the housing and holding a set of terminals, wherein the housing has two coupling tongues and two coupling flanges disposed at two opposite sides at different elevations for enabling the housings two module jacks to be coupled together, and two coupling grooves at two opposite sides for receiving the respective clip; the terminal holder has two vertical coupling flanges bilaterally disposed in reversed directions for enabling the terminal holder of one module jack to be coupled to the terminal holder of another, and a hooked flange for engagement with a hooked flange in the housing of the respective module jack.

Inventors: Chang; Chih-Kai (Taipei Hsien, TW)

Assignee: Teckon Electronics Corp.

International Classification: H01R 9/24 (20060101); H01R 013/60 ()

Expiration Date: 01/02/2018